Main Applications

FPD : Glass alignment

Semicon : Wafer alignment, Bonding alignment

Electronics : Parts inspection

Specifications

• Model
• MML03-HR220DVI-30M58

• Magnification (x)
• 0.3

• O/I [mm]
• 523.6

• WD (mm)
• 218

• Resolution (μm)
• 15.7-31.3

• Depth of Field (mm)
• 6.22-12.45

• NA
• 0.021-0.011

• Effective Fno
• 7-14

• IF (mm)
• 30

• TV Distortion (%)
• ≤0.01

*1 Resolution values indicate the theoretical resolution at a wavelength of 550nm;
*2 Depth of field is calculated assuming a horizontal 240TV resolution using a 1/2 CCD camera. (Permissible circle of confusion on the image-formation side: 40μm).